DIDCO - Diamonds Set in Motion

Synthetic Diamond Grit & Powder

Micron Powder


Metal Bond Micron Powder
Metal Bond Micron PowdersDm-MB is produced from our high quality saw grit. With well-controlled size, shape and transparency, our product is specially designed for metal bond systems.
  • Blocky Shape
  • Very clear particles
  • Well-controlled size
  • High Strength
  • Good oversize control
Resin Bond Micron Powder
Metal Bond Micron PowdersDm-RB is produced from our friable resin bond diamond grit. The micro-chipping structure and self-sharpening features make it suitable for polishing tungsten carbide, PDC, glass and ceramics.
  • Blocky Shape
  • Clean particle surface
  • High friability
  • High Strength
  • Well controlled mean
Bur. Of Stds.
Part No.
Micron Size Approximate Finish
(Micro-Inches)
Equiv. Mesh Sizes Typical Application
SA-1/10-m 0 - 0.25mic. 0 - 0.5 200,000 Super Final Finishing
SA-1/4-m 0 - 0.5mic. 100,000
SA-5/8-m 0.25 - 1mic. 60,000
SA-3/4-m 0.5 - 1mic. 0 - 1  
SA-1/2-m 0 - 1mic.  
SA-1-m 0 - 2mic. 15,000
SA-1.25m 0.5 - 2mic. 14,000
SA-1.5m 1 - 2mic. 13,000
SA-1.75m 0.5 - 3mic. 1 - 2 12,500
SA-2m 1 - 3mic. 12,000
SA-2.25-m 1.5 - 3mic.  
SA-2.5m 2 - 3mic. 10,000
SA-3-m 2 - 4mic. 8,000 General Final Polishing
SA-3.5m 2 - 5mic. 2 - 3 7,000
SA-4m 2 - 6mic. 5,000
SA-4.5m 3 - 6mic  
SA-5-m 4 - 6mic. 4,000
SA-6-m 4 - 8mic. 3 - 5 3,000 General Final Finish
SA-7.5-m 5 - 10mic. 2,200
SA-8-m 6 - 10mic. 2,000
SA-9-m 6 - 12mic. 1,800
SA-10-m 8 - 12mic. 1,600
SA-12-m 8 - 16mic. 4 - 6 1,500
SA-14-m 10 - 18mic. 1,300
SA-15-m 10 - 20mic. 1,200
SA-17-m 12 - 22mic. 7 - 9 1,100 Rough Finish for Dimensions
SA-20-m 15 - 25mic. 1,000
SA-22.5-m 20 - 25mic. 900
SA-25-m 20 - 30mic. 800
SA-29-m 22 - 36mic. 700
SA-30-m 20 - 40mic. 10 - 15 600
SA-35-m 30 - 40mic. 550
SA-40-m 35 - 45mic. 15 - 25 530
SA-45-m 36 - 54mic.  
SA-45-m 40 - 50mic. 520
SA-50-m 40 - 60mic. +25 500 Fast Stock Removal
SA-67-m 54 - 80mic. 325/400
SA-100-m 80 - 125mic. 270/325

Custom sizes & shape configurations available. Request Information.

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